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Thin Film Metallisation
Product Details:
Thin film ceramic metallization schemes at HHV are deposited by magnetron sputtering method and the deposited metal layers show excellent adhesion.
For the resistor applications TaN or NiCr layer and for the solderable applications Ni or Cu is added to the metallization scheme. The sheet resistance of TaN and NiCr layers is a vailable from 10-250Ω/sqr depending upon the application.All layers can be deposited in one cycle without breaking the vacuum by sputtering method.
Class 10,000 clean room is specifically established at HHV for the purpose of depositing defect free metallization coatings.
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Laboratory Equipment