RF/DC Sputtering System
Product Details:
The RF/ DC Magnetron Sputtering System consists of : High Vacuum Pumping module with Turbo Pump. High vacuum chamber with top and bottom Demountable flanges used for sputtering and glow discharge. Chamber is bakeable to 1500 C and compatible to vacuum in the range of 10-7 mb. Hydraulic/Motor-screw rod arrangement for up-down movement of top cover Magnetron cathode : All the sputtering cathodes are mounted in the sputtering chamber for sequential operation and the cathodes are suitably partitioned so that cross contamination of the target is prevented. Horizontal shutter for each target is provided with facility to control from the computer. Stainless steel substrate holder in the sputtering chamber to mount the substrates. Substrate Heater with temperature measurement and control through PID and Thyrister controller upto 800 ± 10 C RF power supply with auto tuner for RF magnetron sputtering and facility for substrate cleaning and DC power supply for DC sputtering Quartz Crystal Thickness Monitor with water cooled Crystal Feedthrough and control console to house all the power supplies, drives, controls and indications. Adjustable distance between target and substrate. 4 Channel mass flow controller with digital display unit of MKS Instruments. Same RF Power supply can be used for etching / cleaning of the substrate with a external switch for selection of polarity.